View 74HCT2G14GV_13972.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
74HC2G14; 74HCT2G14 Inverting Schmitt-triggers
Preliminary specification 2003 May 1
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
FEATURES * Wide supply voltage range from 2.0 to 6.0 V * High noise immunity * Low power dissipation * Balanced propagation delays * Unlimited input rise and fall times * Very small 6 pins package. APPLICATIONS * Wave and pulse shapers for highly noisy environments * Astable multivibrators QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 6.0 ns. DESCRIPTION
74HC2G14; 74HCT2G14
* Monostable multivibrators * Output capability: standard.
The 74HC2G/HCT2G14 is a high-speed Si-gate CMOS device. The 74HC2G/HCT2G14 provides two inverting buffers with Schmitt-trigger action. This device is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
TYPICAL SYMBOL tPHL/tPLH CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total switching outputs; (CL x VCC2 x fo) = sum of outputs. 2. For HC2G the condition is VI = GND to VCC. For HCT2G the condition is VI = GND to VCC - 1.5 V. FUNCTION TABLE See note 1. INPUTS nA L H Note 1. H = HIGH voltage level; L = LOW voltage level. OUTPUTS nY H L PARAMETER propagation delay nA to nY input capacitance power dissipation capacitance notes 1 and 2 CONDITIONS HC2G CL = 50 pF; VCC = 4.5 V 16 2 10 HCT2G 21 2 10 ns pF pF UNIT
2003 May 1
2
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
ORDERING INFORMATION
74HC2G14; 74HCT2G14
PACKAGES TYPE NUMBER TEMPERATURE RANGE 74HC2G14GW 74HC2G14GV 74HCT2G14GW 74HCT2G14GV PINNING PIN 1, 3 2 4, 6 8 GND 2Y to 1Y VCC SYMBOL 1A to 2A data input ground (0 V) data output DC supply voltage DESCRIPTION -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C PINS 6 6 6 6 PACKAGE SC-88 SC-74 SC-88 SC-74 MATERIAL plastic plastic plastic plastic CODE SOT363 SOT457 SOT363 SOT457 MARKING HK H14 TK T14
1A
GND 2A
1 2 3
6
1Y VCC 2Y
1
3
1A 2A
1Y 2Y
6 4
14
5
4
Fig.1 Pin configuration.
Fig.2 Logic symbol.
1
3
6 4
1A
1Y
2A
2Y
Fig.3 IEC logic symbol.
Fig.4 Logic diagram (one driver).
2003 May 1
3
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
RECOMMENDED OPERATING CONDITIONS 74HC2G14 SYMBOL VCC VI VO Tamb PARAMETER supply voltage input voltage output voltage operating ambient temperature CONDITIONS MIN. 2.0 0 0 see DC and AC -40 characteristics per device TYP. 5.0 - - +25
74HC2G14; 74HCT2G14
74HCT2G14 UNIT MIN. 4.5 0 0 -40 TYP. 5.0 - - +25 MAX. 5.5 VCC VCC +125 V V V C
MAX. 6.0 VCC VCC +125
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK IOK IO ICC Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 110 C the value of PD derates linearly with 8 mW/K. PARAMETER supply voltage input diode current output diode current output source or sink current VCC or GND current storage temperature power dissipation per package for temperature range from -40 to +125 C; note 2 VI < -0.5 V or VI > VCC + 0.5 V; note 1 VO < -0.5 V or VO > VCC + 0.5 V; note 1 -0.5 V < VO < VCC + 0.5 V; note 1 note 1 CONDITIONS MIN. -0.5 - - - - -65 - MAX. +7.0 20 20 25 50 +150 300 UNIT V mA mA mA mA C mW
2003 May 1
4
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
DC CHARACTERISTICS
74HC2G14; 74HCT2G14
Type 74HC2G14 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VOH HIGH-level output voltage VI = VIH or VIL: IO = -20 A VI = VIH or VIL: IO = -20 A VI = VIH or VIL: IO = -20 A VI = VIH or VIL; IO = -4.0 mA VI = VIH or VIL; IO = -5.2 mA VOL LOW-level output VI = VIH or VIL; voltage IO = 20 A VI = VIH or VIL; IO = 20 A VI = VIH or VIL; IO = 20 A VI = VIH or VIL; IO = 4.0 mA VI = VIH or VIL; IO = 5.2 mA II ICC Note 1. All typical values are measured at Tamb = 25 C. input leakage current quiescent supply current VI = VCC or GND VCC (V) 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 +25 - - - - - 0.1 0.1 0.1 0.26 0.26 0.1 1.0 Tamb (C) -40 to +85 - - - - - 0.1 0.1 0.1 0.33 0.33 1.0 10 -40 to +125 UNIT - - - - - 0.1 0.1 0.1 0.4 0.4 1.0 20
MIN. TYP.(1) MAX. MIN. MAX. MIN. MAX. 1.9 4.4 5.9 4.18 5.68 - - - - - - - 2.0 4.5 6.0 4.32 5.81 0 0 0 0.15 0.16 - - 1.9 4.4 5.9 4.13 5.63 - - - - - - - 1.9 4.4 5.9 3.7 5.2 - - - - - - - V V V V V V V V V V A A
VI = VCC or GND; 6.0 IO = 0
2003 May 1
5
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
74HC2G14; 74HCT2G14
Type 74HCT2G14 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VOH HIGH-level output voltage VI = VIH or VIL; IO = -20 A VI = VIH or VIL; IO = -4.0 mA VOL LOW-level output VI = VIH or VIL; voltage IO = 20 A VI = VIH or VIL; IO = 4.0 mA II ICC ICC Note 1. All typical values are measured at Tamb = 25 C. input leakage current VI = VCC or GND VCC (V) 4.5 4.5 4.5 4.5 5.5 +25 - - 0.1 0.26 0.1 1.0 300 Tamb (C) -40 to +85 - - 0.1 0.33 1.0 10 375 -40 to +125 UNIT - - 0.1 0.4 1.0 20 410
MIN. TYP.(1) MAX. MIN. MAX. MIN. MAX. 4.4 4.18 - - - - 4.5 4.32 0 0.15 - - - 4.4 4.13 - - - - - 4.4 3.7 - - - - - V V V V A A A
quiescent supply VI = VCC or GND; 5.5 current IO = 0 additional supply VI = VCC - 2.1 V; current per input IO = 0
4.5 to 5.5 -
2003 May 1
6
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
TRANSFER CHARACTERISTICS
74HC2G14; 74HCT2G14
Type 74HC2G14 Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Vt+ positive going threshold see Figs. 5 and 6 VCC (V) 2.0 4.5 6.0 Vt- negative going threshold see Figs. 5 and 6 2.0 4.5 6.0 Vh hysteresis (Vt+ - Vt-) see Figs. 5 and 6 2.0 4.5 6.0 Note 1. All typical values are measured at Tamb = 25 C. Type 74HCT2G14 Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER Vt+ Vt- Vh positive going threshold negative going threshold hysteresis (Vt+ - Vt-) see Figs. 5 and 6 see Figs. 5 and 6 see Figs. 5 and 6 VCC (V) 4.5 5.5 4.5 5.5 4.5 5.5 +25 Tamb (C) -40 to +85 -40 to +125 UNIT +25 Tamb (C) -40 to +85 -40 to +125 UNIT
MIN. TYP.(1) MAX. MIN. MAX. MIN. MAX. 1.0 2.3 3.0 0.3 1.13 1.5 0.3 0.6 0.8 1.18 2.6 3.46 0.6 1.47 2.06 0.6 1.13 1.40 1.5 3.15 4.2 0.9 2.0 2.6 1.0 1.4 1.7 1.0 2.3 3.0 0.3 1.13 1.5 0.3 0.6 0.8 1.5 3.15 4.2 0.9 2.0 2.6 1.0 1.4 1.7 1.0 2.3 3.0 0.3 1.13 1.5 0.3 0.6 0.8 1.5 3.15 4.2 0.9 2.0 2.6 1.0 1.4 1.7 V V V V V V V V V
MIN. TYP.(1) MAX. MIN. MAX. MIN. MAX. 1.2 1.4 0.5 0.6 0.4 0.4 1.58 1.78 0.87 1.11 0.71 0.67 1.9 2.1 1.2 1.4 - - 1.2 1.4 0.5 0.6 0.4 0.4 1.9 2.1 1.2 1.4 - - 1.2 1.4 0.5 0.6 0.4 0.4 1.9 2.1 1.2 1.4 - - V V V V V V
Note 1. All typical values are measured at Tamb = 25 C.
2003 May 1
7
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
TRANSFER CHARACTERISTIC WAVEFORMS
74HC2G14; 74HCT2G14
handbook, halfpage handbook, halfpage
VO
VI
VT+ VT-
VH
VO
MNA027
VH VT- VT+
VI
MNA026
Fig.6 Fig.5 Transfer characteristic.
The definitions of VT+, VT- and VH; where VT+ and VT- are between limits of 20% and 70%.
handbook, halfpage
100
MNA028
handbook, halfpage
1.0
MNA029
ICC (A)
ICC (mA) 0.8
0.6 50 0.4
0.2
0 0 1.0 VI (V) 2.0
0 0 2.5 VI (V) 5.0
Fig.7
Typical HC2G transfer characteristics; VCC = 2.0 V.
Fig.8
Typical HC2G transfer characteristics; VCC = 4.5 V.
2003 May 1
8
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
74HC2G14; 74HCT2G14
handbook, halfpage
1.6
MNA030
ICC (mA)
0.8
0 0 3.0 VI (V) 6.0
Fig.9
Typical HC2G transfer characteristics; VCC = 6.0 V.
handbook, halfpage
2.0
MNA031
handbook, halfpage
3.0
MNA032
ICC (mA)
ICC (mA)
2.0 1.0
1.0
0 0 2.5 VI (V) 5.0
0 0 3.0 VI (V) 6.0
Fig.10 Typical HCT2G transfer characteristics; VCC = 4.5 V.
Fig.11 Typical HCT2G transfer characteristics; VCC = 5.5 V.
2003 May 1
9
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
AC CHARACTERISTICS Type 74HC2G14 GND = 0 V; tr = tf 6.0 ns; CL = 50 pF. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS tPHL/tPLH VCC (V) +25 - - - - - -
74HC2G14; 74HCT2G14
Tamb (C) -40 to +85 - - - - - - -40 to +125 UNIT - - - - - -
MIN. TYP.(1) MAX. MIN. MAX. MIN. MAX. 53 16 13 20 7 5 125 25 21 75 15 13 155 31 26 95 19 16 190 38 32 110 22 19 ns ns ns ns ns ns
propagation delay see Figs 12 and 13 2.0 nA to nY 4.5 6.0 output transition time see Figs 12 and 13 2.0 4.5 6.0
tTHL/tTLH
Note 1. All typical values are measured at Tamb = 25 C. Type 74HCT2G14 GND = 0 V; tr = tf 6.0 ns; CL = 50 pF. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS tPHL/tPLH tTHL/tTLH Note 1. All typical values are measured at Tamb = 25 C. VCC (V) +25 - - Tamb (C) -40 to +85 - - -40 to +125 UNIT - -
MIN. TYP.(1) MAX. MIN. MAX. MIN. MAX. 21 6 32 15 40 19 48 22 ns ns
propagation delay see Figs 12 and 13 4.5 nA to nY output transition time see Figs 12 and 13 4.5
2003 May 1
10
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
AC WAVEFORMS
74HC2G14; 74HCT2G14
V handbook, halfpage I nA input GND t PHL VOH nY output VOL t THL VM VM
10%
VM
VM
t PLH
90%
t TLH
MNA722
For HC2G: VM = 50%; VI = GND to VCC. For HCT2G: VM = 1.3 V; VI = GND to 3.0 V.
Fig.12 The input (nA) to output (nY) propagation delays and output transition times.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL = 50 pF
MNA742
VCC open GND
RL = VO 1 k
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH open VCC GND
S1
Definitions for test circuit: CL = load capacitance including jig and probe capacitance (see "AC characteristics"). RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.13 Load circuitry for switching times.
2003 May 1
11
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
APPLICATION INFORMATION The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula: Pad = fi x (tr x ICCa + tf x ICCa) x VCC Where: Pad = additional power dissipation (W) fi = input frequency (MHz) tr = input rise time (ns); 10% to 90% tf = input fall time (ns); 90% to 10% ICCa = average additional supply current (A).
50 100
74HC2G14; 74HCT2G14
handbook, halfpage
200
MNA036
ICC(AV) (A) 150 positive-going edge
Average ICCa differs with positive or negative input transitions, as shown in Fig.14 and Fig.15. HC2G14/HCT2G14 used in relaxation oscillator circuit, see Fig.16. Note to the application information: 1. All values given are typical unless otherwise specified.
0 0 2.0
negative-going edge 4.0 VCC (V) 6.0
Fig.14 Average ICC for HC Schmitt-trigger devices; linear change of VI between 0.1VCC to 0.9VCC.
handbook, halfpage
200
MNA058
ICC(AV) (A)
handbook, halfpage
R
150
positive-going edge
100
C
MNA035
50
negative-going edge
0 0 2 4 VCC (V) 6
1 1 For HC2G: f = -- ---------------------T 0.8 x RC 1 1 For HCT2G: f = -- -------------------------T 0.67 x RC
Fig.15 Average ICC for HCT Schmitt-trigger devices; linear change of VI between 0.1VCC to 0.9VCC. 2003 May 1 12
Fig.16 Relaxation oscillator using the HC2G/HCT2G14.
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
PACKAGE OUTLINE Plastic surface mounted package; 6 leads
74HC2G14; 74HCT2G14
SOT363
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A
A1
1
e1 e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT363
REFERENCES IEC JEDEC EIAJ SC-88
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
2003 May 1
13
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
74HC2G14; 74HCT2G14
Plastic surface mounted package; 6 leads
SOT457
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A A1 c
1
2
3
Lp
e
bp
wM B detail X
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.1 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT457
REFERENCES IEC JEDEC EIAJ SC-74
EUROPEAN PROJECTION
ISSUE DATE 97-02-28 01-05-04
2003 May 1
14
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
74HC2G14; 74HCT2G14
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2003 May 1
15
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
74HC2G14; 74HCT2G14
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
2003 May 1
16
Philips Semiconductors
Preliminary specification
Inverting Schmitt-triggers
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development
74HC2G14; 74HCT2G14
DEFINITIONS (1) This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 May 1
17

▲Up To Search▲

Price & Availability of 74HCT2G14GV

	To Download 74HCT2G14GV Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .